NCP346
PACKAGE DIMENSIONS
THIN SOT?23?5
SN SUFFIX
CASE 483?02
ISSUE E
NOTES:
1 DIMENSIONING AND TOLERANCING PER
D
ANSI Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
S
5
1
2
4
3
B
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4 A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
L
BURRS.
G
MILLIMETERS
INCHES
A
DIM
A
B
MIN MAX
2.90 3.10
1.30 1.70
MIN MAX
0.1142 0.1220
0.0512 0.0669
C
J
C
D
G
0.90 1.10
0.25 0.50
0.85 1.05
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.05 (0.002)
H
K
M
H
J
K
L
M
S
0.013 0.100
0.10 0.26
0.20 0.60
1.25 1.55
0 _ 10 _
2.50 3.00
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0 _ 10 _
0.0985 0.1181
SOLDERING FOOTPRINT*
1.9
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NCP346/D
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